Fraunhofer IZM

For more than 15 years, Fraunhofer IZM has been organizing the production line at trade fairs for electronics manufacturing – this year also at productronica. The institute is one of the world’s leading organizations for applied research and development of robust and reliable electronics and their system integration. Today, more than 450 employees work together with partners from industry and academia to develop technological solutions for future challenges – for example in chiplet assembly, hybrid bonding, Si-interposer technologies, fan-out wafer level packaging, cryo-packaging, the integration of high-bandwidth memory (HBM), RF characterization, and packaging for 5G/6G applications.

The institute provides its customers with customized system integration technologies at wafer, chip, and board level.

Customers benefit from:

• Industry-compatible high-tech equipment

• Flexible cooperation models

• Trust through IP protection

• International strategic networks