At the SMTconnect 2020 Fraunhofer ISIT focuses on quality and reliability of electronic assemblies, wafer level packaging technology as production-relevant key technology for electronic systems and on development and manufacturing of opto packages for optical microsystems.
Based on decades of experience, ISIT has generated a full range of development and service offerings that enable customers to actively increase the quality and reliability of their products.
For the housing of micro devices on wafer level ISIT focuses on hermetic (vacuum) encapsulation of micro sensors, actuators and micro optical components based on a number of different eutectic metal seal bonding technologies and glass frit bonding all with integrated getter.
The patented glass transformation technology platform with CTE matching to Silicon realizes micro lenses, reflectors and optical windows of specific geometries in large numbers. The glass forming platform is a key technology for the hermetic packaging of MEMS scanners and active optical devices that conform to high demands in respect optical functionalities.
Category: RESEARCH INSTITUTES